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Entries in MACOM (2)

Tuesday
Apr162019

Macom readies its silicon photonics platform for 400G 

  • Macom has announced a laser-integrated photonic integrated circuit (L-PIC) for the 400G-FR4 standard 
  • The company is also working with GlobalFoundries to use the semiconductor foundry’s 300mm wafer silicon photonics process 

Vivek Rajgarhia (centre) being interviewed at OFC. Source: Macom.

Macom has detailed its latest silicon photonics chip to meet the upcoming demand for 400-gigabit interfaces within the data centre. 

The chip, a laser-integrated photonic integrated circuit (L-PIC), was unveiled at the OFC show held last month in San Diego. The L-PIC implements the transmitter circuitry for the 400G-FR4 2km interface standard.

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Wednesday
Jan152014

MACOM acquires Mindspeed to boost 100 Gig offerings  

MACOM has acquired Mindspeed Technologies for $272 million, gaining two of the company's three divisions: high-performance analogue and communications processors. Intel has gained the third wireless infrastructure division of Mindspeed that includes 3G/ LTE infrastructure ICs and small-cell technology that Mindpseed gained with the acquisition of UK firm, Picochip, in 2012. 

 

Ray MoroneyThe Mindspeed acquisition increases the serviceable addressible market for MACOM, both geographical - the company will strengthen its presence in Asia Pacific - and by gaining new equipment vendor accounts. It also broadens MACOM's 100 Gigabit physical device portfolio.

 

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