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Silicon Photonics

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Entries in high-performance computing (3)

Sunday
Jan282018

Ayar Labs advances I/O and pens GlobalFoundries deal 

Silicon photonics start-up, Ayar Labs, has entered into a strategic agreement with semiconductor foundry, GlobalFoundries.

Alexandra Wright-GladsteinAyar Labs will provide GlobalFoundries with its optical input-output (I/O) technology. In return, the start-up will gain early access to the foundry’s 45nm CMOS process being tailored for silicon photonics.

GlobalFoundries has also made an investment in the start-up for an undisclosed fee.

“We gain, first and foremost, a close relationship with GlobalFoundries as we qualify our product for customers,” says Alexandra Wright-Gladstein, co-founder and CEO of Ayar Labs. “That will help us speed up availability of our product and have their weight of support behind us.”

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Tuesday
Mar072017

Stitching together disaggregated chips

The Optical Internetworking Forum (OIF) has begun work on a 112-gigabit electrical interface to connect chips in a multi-chip module.

The ultra-short-reach electrical interface for multi-chip modules adds to the OIF's ongoing CEI-112G project, started in August 2016, to develop a 112 gigabit-per-second (Gbps) serial electrical interface for next-generation optical modules. 

Source: Gazettabyte, OIF data. The year 2018 is an estimate.

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Tuesday
Jun282011

Boosting high-performance computing with optics 

Briefing: Optical Interconnect

Part 2: High-performance computing

IBM has adopted optical interfaces for its latest POWER7-based high-end computer system. Gazettabyte spoke to IBM Fellow, Ed Seminaro, about high-performance computing and the need for optics to address bandwidth and latency requirements.


“At some point when you go a certain distance you have to go to an optical link” 

Ed Seminaro, IBM Fellow 

 

 

 

 

 

IBM has used parallel optics for its latest POWER7 computing systems, the Power 775. The optical interfaces are used to connect computing node drawers that make up the high-end computer. Each node comprises 32 POWER7 chips, with each chip hosting eight processor cores, each capable of running up to four separate programming tasks or threads.  

Using optical engines, each node – a specialised computing card - has a total bandwidth of 224, 120 Gigabit-per-second (12x10Gbps) VCSEL-based transmitters and 224, 120Gbps receivers. The interfaces can interconnect up to 2,048 nodes, over half a million POWER7 cores, with a maximum network diameter of only three link hops.

IBM claims that with the development of the Power 775, it has demonstrated the superiority of optics over copper for high-end computing designs.

 

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