First co-packaged optics switches set for next year

Ranovus says two of its lead customers will deploy co-packaged optics next year.

They will deploy 25.6-terabit Ethernet switch chips but these will be proof-of-concept designs rather than volume deployments.

Hamid ArabzadehThe deployments will be used to assess the software and gain experience with their maintenance including replacing optics if needed.

“I do think 2024 is going to be the volume year,” says Hamid Arabzadeh, CEO of Ranovus, who expects to announce the customers before the year-end.

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Intel details its 800-gigabit DR8 optical module

The company earmarks 2023 for its first co-packaged optics product

Intel is sampling an 800-gigabit DR8 in an OSFP pluggable optical module, as announced at the recent OFC virtual conference and show.

Robert Blum“It is the first time we have done a pluggable module with 100-gigabit electrical serdes [serialisers/ deserialisers],” says Robert Blum, Intel’s senior director, marketing and new business. “The transition for the industry to 100-gigabit serdes is a big step.”

The 800-gigabit DR8 module has eight electrical 100-gigabit interfaces and eight single-mode 100-gigabit optical channels in each transmission direction.

The attraction of the single-module DR8 design, says Blum, is that it effectively comprises two 400-gigabit DR4 modules. “The optical interface allows you the flexibility that you can break it out into 400-gigabit DR4,” says Blum. “You can also do single 100-gigabit breakouts or you can do 800-gigabit-to-800-gigabit traffic.”

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