Teramount brings pluggability to co-packaged optics

Hesham Taha, the CEO and co-founder of Teramount, describes the last two years for his company as eventful.

"Many things have happened on many fronts," he says.

Teramount has developed a fibre assembly technology for designs integrating photonics and chips.

Hesham Taha

The start-up has raised $20 million in funding and has 30 staff. In addition, the company is recruiting staff experienced in manufacturing processes.

"The funding helps to support what we are working on today, which is manufacturing readiness," says Taha.

Taha also notes marketplace changes as when the rising interest in co-packaged caused some companies that had stepped out of silicon photonics to return.

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Drut's agile optical fabric for the data centre

A US start-up has developed a photonic fabric for the data centre that pulls together the hardware needed for a computational task.

Drut Technologies offers management software and a custom line card, which, when coupled with the optical switch, grabs the hardware required for the workload.

Some of the Drut team (L to R): Sumit Jayaswal, member of technical staff; Bill Koss, CEO; and Jitender Miglani, founder and president.

“You can have a server with lots of resource machines: lots of graphic processing units (GPUs) and lots of memory,” says Bill Koss, CEO of Drut. “You create a machine, attach a workload to it and run it; forever, for a day, or 15 minutes.”

Drut first showcased its technology supporting the PCI Express (PCIe) bus over photonics at server specialist, SuperMicro’s exhibition stand, at the Supercomputing 22 show held last November in Dallas, Texas.

“This is a fully reconfigurable, direct-connect optical fabric for the data centre,” says Koss.

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Data centre photonics - an ECOC report

• ECOC 2022 included talks on optical switching and co-packaged optics.
• Speakers discussed optical switching trends and Google's revelation that it has been using optical circuit switching in its data centres.
• Nvidia discussed its latest chips, how they are used to build high-performance computing systems, and why optical input-output will play a critical role.

Co-packaged optics and optical switching within the data centre were prominent topics at the recent ECOC 2022 conference and exhibition in Basel, Switzerland.

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Tencent makes its co-packaged optics move

• Tencent is the first hyperscaler to announce it is deploying a co-packaged optics switch chip

• Tencent will use Broadcom’s Humboldt that combines its 25.6-terabit Tomahawk 4 switch chip with four optical engines, each 3.2 terabit-per-second (Tbps)

Part 2: Broadcom's co-packaged optics 

Tencent will use Broadcom’s Tomahawk 4 switch chip co-packaged with optics for its data centres.

Manish Mehta

“We are now partnered with the hyperscaler to deploy this in a network,” says Manish Mehta, vice president of marketing and operations optical systems division, Broadcom. “This is a huge step for co-packaged optics overall.”

The Chinese hyperscaler will use Broadcom’s 25.6Tbps Tomahawk 4 Humboldt, a hybrid design where half of the chip’s input-output (I/O) is optical and half is the chip’s serialisers-deserialisers (serdes) that connect to pluggable modules on the switch’s front panel.

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The various paths to co-packaged optics

Near package optics has emerged as companies have encountered the complexities of co-packaged optics. It should not be viewed as an alternative to co-packaged optics but rather a pragmatic approach for its implementation.

Co-packaged optics will be one of several hot topics at the upcoming OFC show in March.

Placing optics next to silicon is seen as the only way to meet the future input-output (I/O) requirements of ICs such as Ethernet switches and high-end processors.

Brad Booth

For now, pluggable optics do the job of routing traffic between Ethernet switch chips in the data centre. The pluggable modules sit on the switch platform’s front panel at the edge of the printed circuit board (PCB) hosting the switch chip.

But with switch silicon capacity doubling every two years, engineers are being challenged to get data into and out of the chip while ensuring power consumption does not rise.

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Intel sets a course for scalable optical input-output

• Intel is working with several universities to create building-block circuits to address its optical input-output (I/O) needs for the next decade-plus.

• By 2024 the company wants to demonstrate the technologies achieving 4 terabits-per-second (Tbps) over a fibre at 0.25 picojoules-per-bit (pJ/b).

Intel has teamed up with seven universities to address the optical I/0 needs for several generations of upcoming products.

The initiative, dubbed the Intel Research Center for Integrated Photonics for Data Centre Interconnects, began six months ago and is a three-year project.

No new location is involved, rather the research centre is virtual with Intel funding the research. By setting up the centre, Intel’s goal is to foster collaboration between the research groups.

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Preparing for a post-pluggable optical module world

Part 1: OIF: ELSFP, XSR+, and CEI-112G-Linear

The OIF is working on several electrical and optical specifications as the industry looks beyond pluggable optical transceivers.

One initiative is to specify the external laser source used for co-packaged optics, dubbed the External Laser Small Form Factor Pluggable (ELSFP) project. 

Nathan Tracy

Industry interest in co-packaged optics, combining an ASIC and optical chiplets in one package, is growing as it becomes increasingly challenging and costly to route high-speed electrical signals between a high-capacity Ethernet switch chip and the pluggable optics on the platform’s faceplate.

The OIF is also developing 112-gigabit electrical interfaces to address not just co-packaged optics but also near package optics and the interface needs of servers and graphics processor units (GPUs).

Near package optics also surrounds the ASIC with optical chiplets. But unlike co-packaged optics, the ASIC and chiplets are placed on a high-performance substrate located on the host board.

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