DT chooses Nokia for a major optical network upgrade

Deutsche Telekom is redesigning its domestic optical network and has chosen Nokia as its equipment supplier.

“They are re-architecting and rolling out, in a short time, a huge portion of their optical network,” says Kyle Hollasch, (pictured) director of optical portfolio marketing, Nokia. “We are displacing in many parts of the network four different vendors.”

Network architecture

Deutsche Telekom’s legacy mesh-based wavelength-division multiplexing (WDM) network uses equipment from several vendors. In the last decade, Deutsche Telekom also added to the core an IP-optical solution from Cisco Systems.

Now, the CSP is replacing the mesh-WDM network and the Cisco IP-optical core with an OTN-WDM core from Nokia.

“They are unifying their traffic from all of their business services, government services, 5G anyhaul and the core IP network onto one core WDM network,” says Hollasch. 

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Enabling 800-gigabit optics with physical layer ICs

Broadcom recently announced a family of 800-gigabit physical layer (PHY) chips. The device family is the company’s first 800-gigabit ICs with 100-gigabit input-output (I/O) interfaces.

Source: Broadcom

Moving from 50-gigabit to 100-gigabit-based I/O enables a new generation of 800-gigabit modules aligned with the latest switch chips.

“With the switch chip having 100-gigabit I/Os, PHYs are needed with the same interfaces,” says Machhi Khushrow, senior director of marketing, physical layer products division at Broadcom.

Broadcom’s latest 25.6 terabit-per-second (Tbps) Tomahawk 4 switch chip using 100-gigabit I/O was revealed at the same time.

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Rebooting telecom innovation

Last summer several individuals, including representatives from Telefonica and Deutsche Telekom, published a White Paper on the need to boost innovation in the telecom industry.

Don Clarke

Six months and many conversations later, the group published its second paper, this time focussing on the communications service providers (CSPs), vendors and the investor community.

The paper, entitled Developing a Code of Conduct Framework for the Telecom Ecosystem, highlights four areas to spur innovation: Funding, Innovation Processes, Competition and Procurement.

The code-of-conduct paper offers guidelines as to how CSPs can work with vendors, especially small and medium-sized ones that lack the resources of the larger established vendors.

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Books 2020: Part III

Gazettabyte asked industry figures to pick their reads during last year. In the final post - Part III - Alexis Bjorlin and Don Clarke choose theirs.

Alexis Bjorlin, Senior Vice President and General Manager, Optical Systems Division, Broadcom

In 1996, during my first semester as a graduate student in Santa Barbara, I both lost myself and found companionship in Gabriel Garcia Marquez’s epic saga, One Hundred Years of Solitude. This work of magical realism has become my comparand against which all other works of fiction are measured.

In 2020, I revisited the town of Macondo and the Buendia family, and discovered a whole new world, offering striking comparisons to our current history, replete with juxtaposed conservative and progressive narratives, luring me into a suspension of disbelief to enjoy the richness of the family and their century-long story unfolding.

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The compound complexity of co-packaged optics

Part 1: The OIF’s co-packaging initiative

Large-scale data centres consume huge amounts of power; one building on a data centre campus can consume 100MW. But there is a limit as to the overall power that can be supplied.

Jeff Hutchins

The challenge facing data centre operators is that networking, used to link the equipment inside the data centre, continues to consume more and more power.

That means less power remains for the servers; the compute that does the revenue-generating work.

This is forcing a rethink regarding networking and explains the growing interest in co-packaged optics, a technique that effectively adds optical input-output (I/O) to a chip.

Two industry organisations - the OIF and The Consortium for On-Board Optics (COBO) - have each started work to identify the requirements needed for co-packaged optics adoption.

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100-gigabaud optics usher in the era of terabit transmissions

•  NeoPhotonics has unveiled a coherent modulator and receiver that operate at over 100 gigabaud.

Telecom operators are in a continual battle to improve the economics of their optical transport networks to keep pace with the relentless growth of IP traffic.

One approach is to increase the symbol rate used for optical transmission. By operating at a higher baud rate, more data can be carried on an optical wavelength.

Ferris Lipscomb

Alternatively, a higher baud rate allows a simpler modulation scheme to be used, sending the same amount of data over greater distances. That is because the fewer constellation points of the simpler modulation scheme help data recovery at the receiver.

NeoPhotonics has detailed two optical components - a coherent driver-modulator and an intradyne coherent receiver (micro-ICR) - that operate at over 100 gigabaud (GBd). The symbol rate suits 800-gigabit systems and can enable one-terabit transmissions.

NeoPhotonics’ coherent devices were announced to coincide with the ECOC 2020 show.

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Ayar Labs’ TeraPhy chiplet nears volume production

Moving data between processing nodes - whether servers in a data centre or specialised computing nodes used for supercomputing and artificial intelligence (AI) - is becoming a performance bottleneck.

Workloads continue to grow yet networking isn’t keeping pace with processing hardware, resulting in the inefficient use of costly hardware.

Networking also accounts for an increasing proportion of the overall power consumed by such computing systems.

These trends explain the increasing interest in placing optics alongside chips and co-packaging the two to boost input-output (I/O) capacity and reach.

At the ECOC 2020 exhibition and conference held virtually, start-up Ayar Labs showcased its first working TeraPHY, an optical I/O chiplet, manufactured using GlobalFoundries’ 45nm silicon-photonics process.

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