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Entries in Kandou Bus (1)

Tuesday
Mar072017

Stitching together disaggregated chips

The Optical Internetworking Forum (OIF) has begun work on a 112-gigabit electrical interface to connect chips in a multi-chip module.

The ultra-short-reach electrical interface for multi-chip modules adds to the OIF's ongoing CEI-112G project, started in August 2016, to develop a 112 gigabit-per-second (Gbps) serial electrical interface for next-generation optical modules. 

Source: Gazettabyte, OIF data. The year 2018 is an estimate.

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