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Entries in Edgecore Networks (4)

Wednesday
Nov142018

Edgecore exploits telecom’s open-networking opportunity 

Part 2: Open networking

Edgecore Networks is expanding its open networking portfolio with cell-site gateways and passive optical networking (PON) platforms. 

The company is backing two cell-site gateway designs that aggregate traffic from baseband units for 4G and 5G mobile networks. One design is from the Open Compute Project (OCP) that is available now and the second is from the Telecom Infra Project (TIP) that is planned for 2019 (see table).

Edgecore has also announced PON optical line terminal (OLT) platforms addressing 10-gigabit XGS-PON and GPON.

Source: ADVA, Edgecore Networks

Edgecore is a wholly-ownedsubsidiary of Accton Technology, a Taiwanese original design manufacturer (ODM) employing over 700 networking engineers that reported revenues exceeding $1.2 billion in 2017.

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Saturday
Nov102018

TIP launches a disaggregated cell-site gateway design 

Part 1: TIP white-box designs

Four leading telecom operators, members of the Telecom Infra Project (TIP), have developed a disaggregated white-box design for cell sites. The four operators are Orange, Telefonica, TIM Brazil and Vodafone. BT is also believed to be backing the open-design cell-site venture.

 Source: ADVA

The first TIP cell-site gateway product, known as Odyssey-DCSG, is being brought to market by ADVA and Edgecore Networks.

TIP isn’t the only open design framework that is developing cell-site gateways. Edgecore Networks contributed in October a design to the Open Compute Project (OCP) that is based on an AT&T cell-site gateway specification. There are thus two overlapping open networking initiatives developing disaggregated cell-site gateways. 

ADVA and Edgecore will provide the standardised cell-site gateways as operators deploy 5G. The platforms will support either commercial cell-site gateway software or open-source code. 

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Tuesday
Sep182018

Switch chips not optics set the pace in the data centre  

Broadcom is doubling the capacity of its switch silicon every 18-24 months, a considerable achievement given that Moore’s law has slowed down. 

Last December, Broadcom announced it was sampling its Tomahawk 3 - the industry’s first 12.8-terabit switch chip - just 14 months after it announced its 6.4-terabit Tomahawk 2.

Rochan SankarSuch product cycle times are proving beyond the optical module makers; if producing next-generation switch silicon is taking up to two years, optics is taking three, says Broadcom. 

“Right now, the problem with optics is that they are the laggards,” says Rochan Sankar, senior director of product marketing at switch IC maker, Broadcom. “The switching side is waiting for the optics to be deployable.”

The consequence, says Broadcom, is that in the three years spanning a particular optical module generation, customers have deployed two generations of switches. For example, the 3.2-terabit Tomahawk based switches and the higher-capacity Tomahawk 2 ones both use QSFP28 and SFP28 modules. 

In future, a closer alignment in the development cycles of the chip and the optics will be required, argues Broadcom.

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Monday
Dec182017

TIP tackles the growing complexity of open design

Axel Clauberg outlined the challenges facing the telecom industry in his opening address at the recent Telecom Infra Project (TIP) summit.

The TIP chairman and vice president, technology innovation at Deutsche Telekom, described how the relentless growth of IP traffic is causing production costs to rise yet the average revenues per subscriber for bundled communication services is flat or dipping. “Not a good situation to be in,” he said. The industry is also investing in new technologies including the rollout of 5G.

Niall Robinson

The industry needs a radically different approach if it is to achieve capital efficiency, says Clauberg, and that requires talent to drive innovation. Garnering such talent requires an industry-wide effort and this is the motivation for TIP.

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